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Solder preforms for IGBT
Solder preforms for IGBT
特点：
Using gold and tin with a purity of 99.99% to realize high corrosion resistance and high temperature service;
High soldering strength;
High resistance to creep and fatigue;
High electric conductivity and thermal conductivity;
High wettability, no need to add soldering flux;
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产品介绍
产品信息
Characteristics
Suitable for reducing atmosphere vacuum soldering process, achieving low residue, low porosity, and highreliability soldering.
Low oxygen
content High purity
Low porosity
New type of high-reliability solder preforms
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