Gold-tin solder is mainly made of high-purity gold and high-purity tin with a purity of 99.99%. It exhibits many advantages such as high strength, high corrosion resistance, high operating temperature, high creep and fatigue resistance, high electrical and thermal conductivity, and does not require the addition of flux due to its excellent wettability. Gold-tin solder can be used for the soldering of various components such as sealed packaging devices,  power semiconductor components, radio frequency and microwave components, optoelectronic components, etc., and is therefore widely used in aerospace, medical equipment and other fields with high reliability requirements.